Does not contain Cadmium (Cd) more than 0.01% by weight, Lead (Pb), Mercury (Hg), Poly Brominated Biphenyl (PBB), Poly Brominated Diphenyl Ethers (PBDE), Bis (2-ethylhexyl) phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Di Butyl Phthalate (DBP) and
Anti-static field packaging for ESD sensitive materials