Replaces GE Healthcare 46-170212P1

THERMAL JOINT COMPOUND, 2 OZ CONTAINER

The Wakefield No.120-2 Joint Compound Silicone is used in X-Rays. The 120-2 from Wakefield Solutions is a silicone oil-based thermal joint compound fills the minute air gap between mating surfaces with a grease like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05 deg C/W for a 0.001 Inch film with an area of one square Inch. There is no measurable increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period. The join compound is designed to reduce the heigh thermal impedance of the air gap. Wakefield-Vette provides complex thermal solutions required to meet thermal engineering challenges of electronics packaging densities. Wakefield Solutions specializes in thermal management solutions for DC/DC converters, extruded heat sinks, board-level heat sinks, and integrated heat sinks. Wakefield-Vette offers a wide range of aluminum extrusion heat sink profiles, for natural and forced convection applications, device-specific heat sinks, precision clamps and thermal management pads, adhesives and greases. Wakefield Solutions leverages its vertically integrated engineering and manufacturing capabilities to offer turnkey solutions in industry-leading delivery times to niche service markets

The Wakefield No.120-2 Joint Compound Silicone is used in X-Rays. The 120-2 from Wakefield Solutions is a silicone oil-based thermal joint compound fills the minute air gap between mating surfaces with a grease like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05 deg C/W for a 0.001 Inch film with an area of one square Inch. There is no measurable increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period. The join compound is designed to reduce the heigh thermal impedance of the air gap. Wakefield-Vette provides complex thermal solutions required to meet thermal engineering challenges of electronics packaging densities. Wakefield Solutions specializes in thermal management solutions for DC/DC converters, extruded heat sinks, board-level heat sinks, and integrated heat sinks. Wakefield-Vette offers a wide range of aluminum extrusion heat sink profiles, for natural and forced convection applications, device-specific heat sinks, precision clamps and thermal management pads, adhesives and greases. Wakefield Solutions leverages its vertically integrated engineering and manufacturing capabilities to offer turnkey solutions in industry-leading delivery times to niche service markets